Senior Signal/Power Integrity Engineer in Sunnyvale, California at Lyte AI

About Lyte

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!

About the role

• We are seeking Senior Level PCB Signal/Power Integrity Engineer to own and execute high-speed Signal Integrity (SI) and Power Distribution Network (PDN) simulations and validation.

What you'll do

• Collaborate with multi-disciplinary engineers (EE, System and Package) to define electrical performance related to SI, PI, EMI and EMC
• Develop engineering test plans and methodologies for SI and PI simulation, including modelling of power networks, parasitic, impedance-controlled transmission lines, vias, connectors, sockets, and system components.
• Validate power and signal integrity in laboratory settings, ensuring alignment with design specifications and simulation outcomes.
• Analyze simulation and lab data to identify design issues and propose corrective actions.
• Ability to support multiple projects concurrently, ensuring timely completion of design and validation tasks.

Required Qualifications

• Bachelor's degree in Electrical Engineering, or related field with at least 8 years of experience
• Proficiency with Ansys SIwave, Ansys HFSS, Altium 365, Cadence Sigrity, and Keysight ADS
• Experience design in of complex SoCs, PMICs, mixed-signal analog/digital designs for sensors and high-speed interfaces such as LPDDR4/4x, MIPI, 10G Ethernet and PCIe Gen 2/3
• Experience with system-level timing, loss budget including silicon, package and board impairments
• Experience with lab measurements, debugging, and SI correlations using oscilloscopes, spectrum analyzer, VNA and TDR
• Fluent in English communication, able to collaborate with teammates in different time zones
• Ability to travel internationally as needed
• Maintain company confidential information are a must

Preferred Qualifications

• Master’s degree with more experience is highly desired
• Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues
• Nice to have experience in substrate design and packaging technology
• Familiar with some of the device packaging processes such as die attach, flip chip, and wire bonding.
• Data analysis experience such as JMPs is a plus; Excel is OK.
• Programming and software maintenance skills are desired e.g. python, or C++

Benefits (subject to location and local regulations)

• Competitive salary and equity
• Comprehensive medical, dental, and vision coverage
• 401(k) retirement plan
• Flexible vacation and time-off policy
• Collaborative, fast-paced, and inclusive work environment
• Opportunity to work on cutting-edge technologies with a highly cross-functional team