AI Server/Rack Architecture Engineer in Santa Clara, California at Foxconn-PCE Technology
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Job Description
Company Overview:
Established in Taiwan in 1974, Hon Hai Technology Group, commonly known as Foxconn, is the world’s largest electronics manufacturer and leading provider of technological solutions with a network of over 233 campuses across 24 countries. In the US, Foxconn employs 8,000 across 56 different sites with manufacturing operations in Virginia, Wisconsin, Ohio, Indiana, Texas, and California. As of 2025, Foxconn ranks 28th among the Fortune Global 500 and reported revenue of approximately USD $259 billion.
The company’s diverse product offerings span four major segments: smart consumer electronics, cloud, and networking solutions, computing, and various other components. Foxconn makes 40% of the consumer electronics that we find in our everyday lives. In recent years, Hon Hai has adopted the 3+3 strategy, focusing on three emerging industries - electric vehicles, digital health solutions, and robotics - while leveraging three key technologies: next-generation communications, artificial intelligence (AI), and semiconductors. Together, these initiatives position the company as a leader in innovation for the 21st century.
Hon Hai Technology Group is deeply committed to championing environmental sustainability within its manufacturing processes. By integrating sustainability into its operations framework, the company strives to serve as a best-practice model for global enterprises, enhancing corporate responsibility while meeting the growing demand for environmentally conscious production methods.
Job Summary:
The primary purpose of the AI Server / Rack Architecture Engineer (focused on L10/L11 system-level execution) is to own the physical-to-logical system blueprint, hardware configuration rules, and deployment blueprints for integrated AI supercomputer racks. This role directly contributes by acting as the ultimate system architect on the floor. They translate the high-level, theoretical chip designs from silicon vendors and the hyper-specific, customized hardware demands of Tier-1 hyperscale’s into a structured, validated, and executable rack integration matrix.
Duties and Responsibilities:
- Define and optimize rack-level system architecture, integration topology, and technical blueprints for AI server platforms, ensuring compute, network, power, cooling, storage, and mechanical subsystems are properly integrated to meet performance, scalability, reliability, and deployment requirements.
- Identify and resolve design conflicts and interface issues across hardware, mechanical, thermal, power, network, and firmware subsystems by establishing clear technical boundaries, interface requirements, and integration standards to ensure overall system compatibility and stability.
- Translate hyperscale customer requirements into rack-level architecture and design specifications while evaluating alignment with applicable Open Compute Project (OCP) standards. Coordinate required design customizations and compliance activities to ensure solutions meet customer, platform, and deployment requirements.
- Analyze system telemetry, diagnostic data, and failure patterns to identify complex rack-level integration and structural issues. Lead technical triage and root-cause investigations with cross-functional engineering teams to determine corrective actions and improve system reliability.
- Manage architecture-related Engineering Change Orders (ECOs) and evaluate their impact on rack-level design, interfaces, performance, and integration. Provide structured feedback to R&D teams based on validation, failure analysis, and production findings to drive design improvements and prevent recurring issues.
Education:
- Bachelor of Science (BS) Degree in Computer Engineering, Electrical Engineering, Systems Engineering, or Computer Science (paired with heavy, documented experience in computer hardware architecture or data center systems)
Experience:
- 1+ years of High-Performance Computing (HPC) or Enterprise Server Architecture
- 1+ years of High-Speed Interconnect Fabric & Scale-Out Cluster Topologies
- 1+ years of Open Compute Project (OCP) & Data Center Deployment Compliance
Physical Demands & Working Conditions:
- Frequently remains stationary while performing system architecture, design reviews, and data analysis, and occasionally moves throughout laboratory, testing, and office areas to support rack-level integration and validation activities.
- Occasionally operates or handles AI server/rack equipment, test instruments, components, tools, and related hardware during integration, troubleshooting, and validation activities.
- Occasionally bends, reaches, crouches, or positions self to access rack-level equipment and frequently observes and evaluates hardware configurations, system connections, and test conditions.
- Frequently exchanges technical information with R&D, hardware, mechanical, thermal, power, network, firmware, and other cross-functional teams to coordinate system integration and resolve technical issues.
- Frequently works in office, engineering laboratory, and server/test environments and may be exposed to operating equipment, elevated noise levels, temperature variations, and other equipment-related conditions; appropriate PPE may be required.
EEOC Statement
Foxconn is an equal opportunity employer that is committed to diversity and inclusion in the workplace. Foxconn prohibits discrimination and harassment of any kind and provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, gender, religion, sex, sexual orientation, ethnicity or national origin, age, disability, marital status, genetics, pregnancy, or any other protected characteristic as outlined by federal law. In addition to federal law requirements, Foxconn complies with applicable state and local laws governing nondiscrimination in employment in every location in which the company has facilities. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, and transfer, leaves of absence, compensation, and training.