Field Application Engineer in Taipei at Boston Materials

The Role

We are seeking a highly motivated Field Applications Engineer to serve as the primary technical partner for our customers in Taiwan as they evaluate and adopt our high-performance thermal interface material (TIM) products. The role is based in Taipei, Taiwan-remote with frequent on-site customer visits.

This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation. You will be responsible for leading early- to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the data, samples, and support they need to successfully integrate and qualify our TIM in their advanced semiconductor packaging applications.

This position offers the opportunity to work closely with hyperscalers, ODMs, OSATs, and foundries to influence the adoption of cutting-edge thermal solutions in next-generation AI and HPC silicon and data center systems.

Join us to solve one of the most critical challenges facing AI Infrastructure and High Performance Computing – thermal management!

• Act as the primary technical point of contact for ODM, OSAT, and Foundry customers, leading the on-site technical integration of our liquid-metal TIMs during early and mid-stage engagements.
• Support customer assembly and testing trials, locally coordinating mechanical and reliability testing to validate mass production feasibility, while troubleshooting technical issues in real-time with internal teams.
• Work closely with the business development team to uncover and document precise customer technical requirements, including geometric, load, assembly constraints, thermal budgets, and reliability standards.
• Capture customer feedback and synthesize technical insights to support the US-based R&D team in continuous product improvement and roadmap planning.
• Prepare and deliver critical technical content such as application notes, design guides, and data reports to support customer decision-making and qualification processes.
• Document designs for customer coordination and lead local efforts to fabricate provisions and mockups (either internally or externally) to ensure customer schedules are met.

• Bachelor’s or Master’sdegree in Mechanical Engineering,Materials Science, ElectricalEngineering, or related field.
• CAD modeling and drafting, hands-on experienceprototyping, mechanical and thermaltesting, data analysis, and report generation.
• 3–7 years of experience in semiconductor packaging,electronics assembly,thermal interface materials, or applications engineering in a B2B technical product company.
• Strong understanding of system-level processor packaging/thermaldesign (cold plate and stiffener/lid design, TIM1/TIM1.5/TIM2selection) and associated reliability testing (uHAST, TCT, HTS, etc.).
• Proven ability to lead cross-functional technical efforts and deliver customer-specific solutions on time.
• Excellent communication skills, with the ability to explain complex technical topics to both engineers and non-technical stakeholders.
• Experience with design and fabrication of elastomeric materials is a plus.
• Familiarity with tools such as thermal test setups, C-SAM, X-ray, or FEA modeling is a plus.
• Bilingual proficiency in Mandarin and English (both written and spoken) to effectively act as the primary liaison between customers and our US-based engineering teams.

• Competitive Compensation: Salary and benefits package fully compliant with the Taiwan Labor Standards Act (LSA).
• Health & Security: Comprehensive coverage including mandatory enrollment in Taiwan’s National Health Insurance (NHI) and Labor Insurance systems.
• Culture & Integration: Full integration into the Boston Materials global engineering team, including direct access to HQ leadership and internal product development resources.