Packaging Design and SI/PI Engineer in Bucharest, București at Lyte AI

• About Lyte

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!

About the role

• We are seeking a middle to senior level packaging design and signal/power integrity Engineer with degree in Electrical Engineering, or a related field.

What you'll do

• Own the design and layout of our micro-electronic package, the heart of our LyteCore system
• Collaborate with multi-disciplinary team of engineers (silicon, photonics, system, operations) to define physical and electrical performance specifications for the package
• Perform signal/power integrity simulation to optimize our package & system performance
• Work with our substrate/package vendors to ensure design for manufacturability and support delivery of our design on time. Work with said vendors to define high volume price target.
• Project tracking weekly.
• Write technical reports and present results.
• Maintain EDA tools and actively project future needs, including improving design flow definition and recommending EDA envelope.

Required Qualifications

• Minimal requirement is a bachelor's degree with 5 years of experience
• Fluent in English communication, able to collaborate with teammates in different time zones
• Experience in substrate design and packaging technology
• Experience in signal and power integration simulation and interpretation of the results
• Experience in EDA tools: Siwave, HFSS, APD, or similar
• Maintain company confidential information are a must

Preferred Qualifications

• Master’s degree with more experience is highly desired
• Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues
• Experience with hands-on testing of electronic packages/systems.
• Knowledge and experience in at least some following processes: device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
• Experience in other EDA tools such as Altium, Allegro PCB, Spectre, Hspice, Sigrity, ADS.
• Data analysis experience such as JMPs is a plus; excel is OK.
• Programming and software maintenance skills are desired eg. python, or C++
• Describe the experience and attributes of the ideal candidate

Benefits (subject to location and local regulations)

• Competitive salary and equity
• Flexible vacation and time-off policy
• Collaborative, fast-paced, and inclusive work environment
• Opportunity to work on cutting-edge technologies with a highly cross-functional team