Failure Analysis Engineer III in Newburyport, Massachusetts at Rochester Electronics

Experienced Sr. Electrical Failure Analysis Engineer to perform debug, fault isolation, and root cause analysis of prototype and production devices. The candidate will have the experience in Semiconductor FA to help guide lower level Engineers through the process and have the knowledge and Leadership to justify lab investments for us to strive to be “Best in Class”.

Ø Perform electrical verification and fault isolation on highly complex ICs (Analog, Digital, ASICs, Microprocessors, etc.) in package, die, or wafer form to determine the failure mechanism.

Ø High level understanding of FA tools demonstrating beginning subject matter expertise requiring little supervision.

Ø Replicate ATE test data on the manual FA bench using ATE datalogs, product datasheets, curve tracers, parametric analyzers, AC/DC test equipment, and collaborate with product and test engineers.

Ø Works on more complex assignments where judgement and initiative are required and acts as a quality agent and drives others to a quality mindset.

Ø Ability to gather and interpret PEM (photon emission microscopy), TIVA (Thermal Induced Voltage Alterations) and Thermal hot spot data and drive to the correct failure location using CAD design data.

Ø Perform material characterization of the failure mechanism (SAM, X-RAY, SEM, EDS, cross-sections, etc.) to assist with root cause analysis.

Ø Perform decapsulation of various packages including hermetic and plastic molded packages utilizing various techniques such as chemical, laser and mechanical methods.

Ø Perform deprocessing of die or wafers using a combination of chemical, mechanical or RIE etching. Must be able to work with caution and safety in mind while working with chemicals and physical de-processing with an attention to detail.

Ø Works closely with the Mfg. organization, Assembly, Product, and Test Engineering to understand the organizations goals and help them meet all requirements and deadlines, by turning around FA requests in a timely manner.

Ø Work in a hands-on position where the individual will be doing majority of their work on an independent basis.

Ø Perform installations of FA equipment and coordinates maintenance and testing procedures to ensure proper working order of the tool.

Ø Proactively write and maintain Failure Analysis Lab procedures. Effectively compile comprehensive FA reports.

Ø Identify and address potential areas for improvement including tools, cycle time, utilization and cost.

Ø Must be able to handle several active projects at one time (multitask) with limited assistance or instruction. Research and develop new capabilities based on project needs.

Ø Help management prioritize the job queue and maintain alignment with department goals.

Ø Mentor and guide junior analysts on lab tools and techniques.

to backfill senior FA engineer Jon Patten. FA backlog is up over 200% and growing. queue time is 70% of wait times due to growing backlog from recreation and MFG support

Ø Perform electrical verification and fault isolation on highly complex ICs (Analog, Digital, ASICs, Microprocessors, etc.) in package, die, or wafer form to determine the failure mechanism.

Ø High level understanding of FA tools demonstrating beginning subject matter expertise requiring little supervision.

Ø Replicate ATE test data on the manual FA bench using ATE datalogs, product datasheets, curve tracers, parametric analyzers, AC/DC test equipment, and collaborate with product and test engineers.

Ø Works on more complex assignments where judgement and initiative are required and acts as a quality agent and drives others to a quality mindset.

Ø Ability to gather and interpret PEM (photon emission microscopy), TIVA (Thermal Induced Voltage Alterations) and Thermal hot spot data and drive to the correct failure location using CAD design data.

Ø Perform material characterization of the failure mechanism (SAM, X-RAY, SEM, EDS, cross-sections, etc.) to assist with root cause analysis.

Ø Perform decapsulation of various packages including hermetic and plastic molded packages utilizing various techniques such as chemical, laser and mechanical methods.

Ø Perform deprocessing of die or wafers using a combination of chemical, mechanical or RIE etching. Must be able to work with caution and safety in mind while working with chemicals and physical de-processing with an attention to detail.

Ø Works closely with the Mfg. organization, Assembly, Product, and Test Engineering to understand the organizations goals and help them meet all requirements and deadlines, by turning around FA requests in a timely manner.

Ø Work in a hands-on position where the individual will be doing majority of their work on an independent basis.

Ø Perform installations of FA equipment and coordinates maintenance and testing procedures to ensure proper working order of the tool.

Ø Proactively write and maintain Failure Analysis Lab procedures. Effectively compile comprehensive FA reports.

Ø Identify and address potential areas for improvement including tools, cycle time, utilization and cost.

Ø Must be able to handle several active projects at one time (multitask) with limited assistance or instruction. Research and develop new capabilities based on project needs.

Ø Help management prioritize the job queue and maintain alignment with department goals.

Ø Mentor and guide junior analysts on lab tools and techniques.