Substrate Process Engineer at Atomica – Goleta, California

We are seeking a highly skilled and motivated Substrate Process Engineer with expertise in wafer bonding and high-precision alignment to join our MEMS fabrication team. This role focuses on developing and sustaining critical wafer-level bonding and alignment processes, such as anodic, fusion, direct, and adhesive bonding, with a strong emphasis on sub-micron to micron-level alignment accuracy required for MEMS device integration. The candidate will work closely with process engineering, integration, and R&D teams to enable reliable and scalable backend processes in a cleanroom manufacturing environment.

Atomica is changing the world. Working at Atomica is truly a one-of-a-kind opportunity to impact groundbreaking technology while living in paradise.

Your contributions to our MEMS technology will drive innovation, solve the great problems of our time and directly impact the lives of people across the globe.

Want to live in paradise? Life in Santa Barbara is just that. Atomica is sandwiched between the beautiful Santa Ynez mountains and the pristine Central California coastline. The weather? Absolutely gorgeous. No more shoveling snow or hiding from tornadoes!

Within 5-minutes from the office, you will find rich local culture, world class schools, airport for convenient travel, festivals, and excellent options to wine and dine.

We have had employees move from all over the country and say life has never been better!

$90,000-$140,000

*Atomica encourages applications from candidates at all levels where pay will be based on experience.*